【English Market Research Report】Global Market for Semiconductor and IC Packaging Materials
"Free samples" are currently available! Please check the application method from the [PDF download] button, or apply directly through the related links.
The market size for semiconductor and IC packaging materials is projected to expand from 43.9 billion USD in 2024 to 70.9 billion USD by 2029, growing at a CAGR of 10.1%. This report investigates the global semiconductor and IC packaging materials market, summarizing trends by type, packaging technology, end-use industry, region, and profiles of companies entering the market.
- Company：グローバルインフォメーション
- Price：500,000 yen-1 million yen
